product advantages:
1.The heat pipe has undergone nickel plating treatment. Prevent oxidation and blackening of the heat pipe. The appearance looks better.
2. 6 Heat pipe technology. Good heat dissipation performance, up to 180W TDP.
3. The front of the fan is displayed on the side panel of the chassis. The appearance is better than the tower.
4.The 120mm fan reduces the temperature of the motherboard in a large area.
5.The center distance of the heat pipe edge to the base is carefully designed to avoid interference with the memory module.
6. Down-blow design. While lowering the CPU temperature, it also lowers the motherboard temperature. .
Intel LGA 1150 1151 1155 1156 1200 1700 2011 Socket
AMD AM2/AM2+/AM3/AM3+/AM4/AM5/FM1/FM2
Specification:
Material: copper
Rated voltage: DC12V
TDP: TDP: 150 – 190W Max
Input power: 4.5W
Speed: 1800RPM ± 10%RPM
Max air flow: 64 ± 10% CFM
Maximum air pressure: 1.75 mmH2O
Acoustical noise(AVG.): 28 dBA
fan size : 120mm*120mm*25mm
1 x Cooler
1 x Cooler Bracket
1 x thermal paste (High quality Thermal >8 W/m-K)
(
Packages sent to Mexico will not contain thermal silicone grease. Because the Customs do not support liquid transport
)
Reviews
There are no reviews yet.